Automatic Dual Solder Pot Selective Wave Soldering Machine Suitable for Large-Scale PCB Production (XS-350C)

• Customization: Available
• Axis: 5 Axis
• Style: Floor
• Model NO.: XS-350C
• Control: Automatic
• Application: Electrical & Electronics Industry, Lighting Industry, Auto Industry, Communication Industry
• Certification: CE, ISO
• Product Name: Automatic Dual Selective Soldering
• PCB Weight: Max5kg
• Power Supply: 3Φ 380V 50/60Hz
• PCB Size: 120L*50W-400L*350W(mm)
• Total Power: 25kw
• PCB Top Clearance: Max120mm
• Weight: Approx.900kg
• PCB Bottom Clearance: Max30mm
• Preheating Zone: Bottom and Top
• Soldering Pot Qty: 2 Sets of Solder Pots with Independent Xyz
• Warm-up Time: 20min
• Control System: PC+Machina Card
• Preheat Mode: Far Infrared Ray
• Transport Package: Vacuum Wooden Box
• Specification: 3100L*1400W*1580H (mm)
• Trademark: SDC
• Origin: China
• HS Code: 8515190010
• Production Capacity: 20 Set/Mouth
• Package Size: 330.00cm * 160.00cm * 178.00cm
• Package Gross Weight: 1400.000kg

Product Description

 

Product overview

The XS-320C is a state-of-the-art automation selective wave soldering machine designed for high-efficiency, precision soldering in industrial applications.
Combining advanced modular design and stable performance, it ensures optimal flexibility and reliability for mass production environments.

 

Structure introduction

 

Integrated Process Flow

Full-process integration: Flux application +Top&bottom preheating + Top preheating 1 & soldering 1 + Top preheating 2 & soldering 2.

Ensures consistent soldering quality and reduces thermal stress on components.


Seamless Production Line Integration

On-line transportation capability for continuous in-line production with upstream/downstream equipment.


Modular & Scalable Design

Flexible configuration allows free expansion and module collocation based on production needs.

 

Product Parameters

  

specifications	Parameter
Size	3100L*1400W*1580H (mm)
Power supply	3φ 380V  50/60HZ
Total power	25KW
PCB parameter
PCB size	Min:120(L)*50(W);Max:400(L)*350(W)(mm)
Top component height	Max120mm
Bottom component height	Max30mm
Selective spray system
Spray movement mode	Flux nozzle movement in XYZ axis
Spray flux volume	2L
Spray flux add mode	Manual
Spray cycle time	0.1 Sec/ soldered dot
Spray movement precision	0.05mm
Selective preheat system
Preheat mode	Far infrared ray+ Hot air
Heater position	Top and bottom
Selective Soldering System
Soldering pot qty	2 sets pots with independent XYZ
Soldering movement mode	Soldering pot movement in XYZ axis
Solder capacity	13KG
Solder melting time	30min
Solder nozzle size	Standard D8mm, other sizes is option
Solder cycle time	2 Sec/ soldered dot
Temperature setting range	Max400^OC
Solder dross	0.2Kg/8h(Not N2 protection);0.01Kg/8h( N2 protection)
Conveyor system
Conveyor method	Adopt rail + stainless roller
Exhaust system
Exhaust quantity	2 PCS
Exhaust volume	About 5m³/h
Control system
Control mode	PC+ motion control card
Programming method	Picture, GERBER or CAD file importing
PCB Process parameter	Setting, save , open in the PC screen
Option
Sweep gun

 
 

Effect of soldering

  

XS-350C can achieve 100%  through hole soldr fill, Stable soldering quality with no voids and bridges.

It offer rock-solid connections that withstand mechanical stress, extreme temperatures, and environmental challenges.Adapting to automotive electrical aerospace requirements.

 Solder nozzles can also be customized for your Dip process.

 

Key Features

 

1. Precision Flux Spray System

Selective spray technology reduces flux consumption by ≥90% vs traditional methods.
Ultra-narrow 2mm spray width minimizes ionic contamination (eliminates post-soldering PCB cleaning).
Dual-axis servo motor ensures ±0.02mm positioning accuracy.
Contamination levels meet IPC-J-STD-001 Class 3 standards.
 

 

2. Adaptive Preheating Module

Hybrid heating system for leaded/lead-free/multilayer PCB assembly:
▸Bottom heating: Short-wave infrared technology
▸Top heating: Forced hot-air convection
Integrated preheating stations for each soldering module

 

 

3. Intelligent Soldering Unit

Programmable per-joint parameters:
▸Differential soldering speeds 
▸Custom dwell times (0.01-10s adjustable)
EM Pump Technology™ features:
▸Nitrogen-assisted solder pot
▸Real-time wave height monitoring (±0.05mm)
▸Automatic solder level detection
75% reduction in dross generation vs conventional systems

4. Smart Process Control Software

CAD-based Programming:
▸Drag-and-drop path creation on PCB image overlay
▸Parameter customization per solder joint:
Z-axis penetration depth
Centralized Data Management:
▸Unified file storage for process parameters (flux type, N2 temp, etc.)
▸Excel-compatible report generation
Dual-channel Control:
▸Independent parameter sets for simultaneous dual-nozzle operation

 

Packaging & Shipping

 Standard export-grade wooden case with vacuum-sealed packaging
Shipping methods:
▸Sea freight (cost efficiency)
▸Air express ( urgent small shipments)
▸Custom logistics solutions (door-to-door service available upon request)

Production Cycle
Standard delivery: 35 working days after order confirmation

Payment-to-Shipment
Ships within 5 business days 
 

Why chose XS-350C?

 

Versatility: Adaptable to diverse customer needs through customizable modules and configurations.

Reliability: Stable wave soldering process with minimal maintenance requirements.

Certified Quality: CE , Rohs and ISO certifications guarantee adherence to global industrial standards.

Elevate your production line with the XS-320C - engineered for precision, efficiency, and scalability in modern PCB manufacturing.